Upgradeable, portable and rugged unit for multilayer testing on both copper and optical fiber, Ethernet and telephone networks analysis. This product has been developed in collaboration with Exfo's R&D team.
Industrial Design
Composed of a unique conditioning and command platform combined by quick assembly to different highly specialized test modules. This product meets several requirements concerning ruggedness, rain resistance, heat dissipation (active and passive), modularity and ergonomics. Design of injected plastic casings with overmolding.
Electronic Engineering
Development of the CPU platform. |
